Temperature Effect on Tensile Behaviour of Sn-Pb Eutectic Solder

Abstract

The mechanical behaviour of tin-lead eutectic solder is experimentally investigated by performing tensile tests subjected to the temperatures ranging from -50°C to 150°C. It covers the widely-accepted extreme working environment of high-power electronic devices in the aerospace industry. The regime of strain rates between 1×10-4 s-1 and 1×10-3 s-1 are applied. Despite scatter of the ultimate failures, experimental results demonstrate that tensile strength of Sn-Pb eutectic solder is mainly associated with strain rate and working temperature. With increasing the applied temperature above the room temperature, both Young’s modulus and tensile strength of Sn-Pb specimens exponentially decays.